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| defining a degree of excellence HIGH SPEED LAN MAGNETICS 960017C * Designed for use with AMD 79C872 10/100 Mbps PHY transceiver * Dual, 2-port and quad, 4-port design options offer best board space, performance and cost per port efficiency * 40 pin, low profile surface mount package rated to 225C peak IR reflow temperature * 2000 Vrms isolation * 350H OCL with 8mA DC bias applied Return Loss (dB) Min 30MHz-60MHz Crosstalk (dB) Min 1MHz-100MHz Common to Diff Mode Rej (dB) Min 30MHz 100MHz Common to Common Mode Rej (dB) Min 30MHz 100MHz Schematic ELECTRICALS AT 25C Part No. Insertion Loss (dB) Typ 1MHz-100MHz 1MHz-30MHz 60MHz-80MHz S558-5999-72 S558-5999-73 -1.0 -1.0 -16 -16 16-20log(f/30MHz) 16-20log(f/30MHz) -10 -10 -35 -35 -50 -50 -40 -40 -40 -40 -30 -30 A B SCHEMATICS A B MECHANICAL Specifications subject to change without notice. Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302 * Tel: 201-432-0463 * Fax: 201-432-9542 * E-Mail: BelFuse@belfuse.com Website: http://www.belfuse.com defining a degree of excellence HIGH SPEED LAN MAGNETICS 960017C APPLICATION CIRCUIT APPLICATION NOTES * Bel has designed these part types for use in either 100 Mbps or 10/100 Mbps multi-port applications with AMD's 79C872 PHY transceiver. These dual, 2-port and quad, 4-port devices provide high isolation transformers, wave shaping, fast rise times, EMI and common mode noise suppression. All part types meet the IEEE 802.3 standards, which includes a requirement for 350H OCL (inductance) at 8mA DC bias applied. * The S558-5999-72 includes impedance matching common mode termination on the transmit channel. Good circuit balance on the board layout along with precise selection of the values and tolerances of the discrete external components is critical for proper functionality of this termination. Refer to Bel's application note for proper implementation of the impedance matched common mode termination and possible design considerations to eliminate its use. * Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each part is optically inspected to meet rigid coplanarity requirements. Specifications subject to change without notice. Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302 * Tel: 201-432-0463 * Fax: 201-432-9542 * E-Mail: BelFuse@belfuse.com Website: http://www.belfuse.com |
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